Faculty

Hsin-Chia Lu / 盧信嘉

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Flip chip assembled W-band CMOS chip modules on ceramic substrate with transition compensation for millimeter-wave system-in-package integration

IEEE Trans. Microw. Theory Tech., vol. 60, no. 3, pp. 766-777
H.-C. Lu, C.-C. Kuo, P.-A. Lin, C.-F. Tai, Y.-L. Chang, Y.-S. Jiang, J.-H. Tsai, Y.-M. Hsin, and H. Wang

 Mar 2012
A fully SiP integrated V-band butler matrix end-fire beam switching transmitter using flip chip assembled CMOS chips on LTCC

C.-C. Kuo, H.-C. Lu, P.-A. Lin, C.-F. Tai, Y.-M. Hsin and H. Wang
IEEE Transactions on Microwave Theory and Techniques, Vol. 60, no. 5, 1424-1436

 May 2012
LTCC spiral inductor synthesis and optimization with measurement verification

H.-C. Lu, T. B. Chan, J.-K. Zeng, C. C.-P. Chen, H.-J. Hsing, and C.-M. Liu
IEEE Trans. Adv. Packag., vol. 33, pp. 160-168

 Feb 2010
LTCC layer-to-layer misalignment tolerant coupled inductor and its application to bandpass filter and helical inductors,

H.-C. Lu, T.-W. Chao, Y.-L. Chang, T.-B. Chan and Y.-T. Chou
IEEE Trans. Comp., Packag., Manuf. Technol., vol. 1, no. 10, pp. 1608-1615

 Oct 2011
Miniaturized 60 GHz rectangular ring bandpass filter in 90-nm CMOS technology

H.-C. Lu, C.-S. Yeh and S.-A. Wei
Electron. Lett., vol. 47, issue 7, pp. 448-450

 Mar 2011
Flip chip assembled W-band CMOS chip modules on ceramic substrate with transition compensation for millimetre-wave system-in-package integration

H.-C. Lu, C.-C. Kuo, P.-A. Lin, C.-F. Tai, Y.-L. Chang, Y.-S. Jiang, J.-H. Tsai, Y.-M. Hsin, and H. Wang
IEEE Trans. Microw. Theory Tech., vol. 60, no. 3

 Mar 2012
LTCC layer-to-layer misalignment tolerant coupled inductor and its application to bandpass filter and helical inductors

IEEE Trans. Compon., Packag. Manuf. Technol.. vol. 1, no. 10, pp. 1608-1615,
H.-C. Lu, T.-W. Chao, Y.-L. Chang, T.-B. Chan and Y.-T. Chou

 Oct 2011
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