Electromagnetic Wave Group - Advanced Microwave and RF-SOP Technology

Introduction

The facilities for microwave and millimeter-wave circuit measurements are available in a temperature, moisture and dust controlled room. The probe stations in this laboratory are used for packaging substrate and PCB board testing. An Agilent 4 port network analyzer up to 20GHz and two 2-port VNA up to 67 GHz can make scattering matrix measurement with probe stations. RF impedance/material analyzer, oscilloscopes, spectrum analyzer, and signal generator are supplied in this laboratory. One Cascade Summit 9000 probe station is used for packaging substrate measurement. A two-sided probe station is designed for dual-side probing of PCB board and packaging substrate. Flip chip bonder and wire bonder are also provided for chip interconnection from chip to substrate. This lab has a wire bonder and a flip-chip bonder to provide two most common level one interconnect between die and substrate. The wire bonder can do either ball bond or wedge bond and the flip-chip bonder can provide thermal compressing flip-chip bonding.

Facilities