Mission & Vision


The goals of this project are to promote the development of the millimeter-wave key components and applications using the Si-based or III-V compound MMIC and LTCC or IPD based SOP integration technologies. With the already established world competitiveness, more than 20 years group efforts in the field, the leading advantages in manufacturing capability, and fundamentally, the continuing strategic support from NTU, we hope to achieve the following overall long-term objectives

  • Navigate our academia and industry and cultivate high quality engineers in the advanced microwave/millimeter-wave and SOP integration research and development.
  • Integrate the Si-based MMIC and SOP technologies to develop innovative research and applications of millimeter-wave key components.
  • Collaborate with esteemed research institutes and leading local industries to advance the technologies and strengthen Taiwan’s worldwide competitiveness in science and technology.
  • Explore the millimeter wave spectrum for civil applications to promote Taiwan’s technologies further and advance the benefits of the human.

As a result, we can help Taiwan push towards the worldwide excellence and NTU the Taiwan’s leading position in the RF integration and SOP research, which is reflected in the number of papers in flagship publications, i.e., IEEE Transactions on Microwave Theory and Techniques and IEEE Transactions of Advanced Packaging in full-length papers; IEEE Microwave and Wireless Components Letters in short-length papers; as well as the conferences IEEE International Microwave Symposium and IEEE Topical Meeting on Electrical Performance of Electronic Packaging, to name a few.


The long-range objective of this proposal is to organize a concentrated research program for the advancement and breakthrough in MMIC, packaging, and antenna technologies for pursuing of academic excellence, while the short-range objective is to carry out research topics that will provide the leading edge for the local industry in their technology development. To this end, while continuing the development of various key techniques for transceiver components beyond 100 GHz, we propose a new 60-GHz wireless communication system for multi-Gbps radio link applications and companion circuits, which will also serve as the integration platform to consolidate the contributions of several key components to be developed here. The integration will include contributions from the following four tasks:

  • Task 1: Advanced MMIC Technologies
  • Task 2: Chip Scale Packages and Modeling Techniques
  • Task 3: SOP Integration and EMC Design
  • Task 4: Advanced Antenna Technologies