Faculty

Yi-Chang Lu / 盧奕璋

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Thermal modeling and analysis for 3D-ICs with integrated microchannel cooling

IEEE Trans. Computer-Aided Des. Integr. Syst., vol. 30, no. 9, pp. 1293-1306
H. Mizunuma, Y.-C. Lu, and C.-L. Yang,

Sep 2011
Signal/power integrity modeling of high-speed memory modules using chip-package-board co-analysis

IEEE Trans. Electronmagn. Compat., vol. 52, pp. 381-391
H.-H. Chuang, W.-D. Guo, Y.-H. Lin, H.-S. Chen, Y.-C. Lu, J. Hong, C.-H. Yu, A. Cheng, J. Chou, C.-J. Chang, J. Ku, T.-L. Wu, and R.-B. Wu

 May 2010
Thermal Modeling and Analysis for 3D-ICs with Integrated Microchannel Cooling

H. Mizunuma, Y.-C. Lu, and C.-L. Yang
IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 30, no. 9, 1293-1306

 Sep 2011
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